Chris and Melissa welcome Pete Staples, CEO & co-founder of Blue Clover Devices, for a deep dive into how to plan tests, capture evidence, and debug those mysterious boards that look perfect but don’t work.

Topics include:

• Who is Blue Clover Devices & what’s the PLT?
• Bed-of-nails, ICT, flying probe, and PLT
• What assemblers really need when a board fails
• Production test vs. validation
• Updates on the Stick It Up Your Tube movement
• Ben the Beaver

Links & resources

• Blue Clover Devices — Production Line Tool (PLT).
  Blue Clover Devices
• PLT Reference Docs (test plans, reports, hardware reference).
  docs.pltcloud.com+1
• Blue Clover — Design-for-Test (DFT) Guide (request the PDF).
  Blue Clover Devices

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After a long break (and a few listener wellness checks!), Chris and Melissa return to catch up on what’s kept them busy and share some updates from around the industry. Then, they dive into this episode’s big topic: who’s responsible for the inevitable fallout when it comes to quick-turn PCB assembly?

Topics include:

• Catching up after six months of growth, hiring, and training
• Andrew Seddon’s appearance on The Amp Hour — and how it ties back to the origins of this podcast
• IPC’s rebrand to the Global Electronics Association
• The ongoing saga of stuck parts in tubes (a.k.a. “Stick It Up Your Tube”)
• Quick-turn fallout:
  • Why some customers expect and accept a small percentage of failures
  • Why others demand 100% working boards
  • How assembly shops handle each scenario (good, bad, and ugly approaches)
  • Practical tips for managing fallout: thermal cycling, batch troubleshooting, and respectful customer–assembler relationships
• Pet Peeve of the Week: LinkedIn (and why it feels so weird)

Links & Resources

• Andrew Seddon on The Amp Hour: CircuitHub 12 Years Later
  
  
• IPC rebrand: Global Electronics Association announcement
  
  
• LinkedIn post – stuck part in a tube
  
  
• LinkedIn post – sustainability rant
  
  

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Chris will be in California and would love to meet up with anyone interested.

He will be in the San Francisco Bay Area March 11 - March 14 and the Los Angeles/Anaheim area March 16 - March 20.

Email us at contact@pickplacepodcast.com and we'll try to make something happen!

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In this insightful episode, we delve deep into the pressing issues of sustainability within the electronics manufacturing industry with IPC President and CEO, Dr. John W. Mitchell, and Dr. Kelly Scanlon, IPC's lead sustainability strategist.

They offer expert insights into how IPC is leading the charge toward more sustainable practices, the importance of data and harmonization in policy-making, and the challenges facing the industry today. Our discussion also highlights practical steps manufacturers can take to contribute to a greener future and how IPC's resources can guide these efforts.

If you're interested in learning more about sustainability or getting involved with IPC's initiatives can visit IPC.org for further information and support.

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In this episode, join us as we continue our exploration into the high-speed world of motorsport sensor technology with Caleb Holloway, founder of Izze Racing. Caleb delves into the complexities of antenna design, the challenges of RF engineering in the demanding environment of racing, and the innovative solutions his team has developed to enhance data accuracy on the track. From whip antennas to the nuances of sensor integration on racing vehicles, learn how cutting-edge technology is driving performance and safety in motorsports.

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After a bit of a break we are back with a new, exciting episode! This week we are joined by Caleb Holloway, founder and owner of Izze Racing. Izze Racing provides electronics sensors, with an emphasis on tire data collection, to the motorsport industry. In the first part of this conversation, we delve into Caleb's transition from academia to running his passion company full-time, what's it like designing a product for the motor racing industry, and some unique challenges he has faced.

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In this episode, we continue our conversation from last episode with Dave Wilcox, PCB CAM engineer at CircuitHub, to explore the intricacies of plugging and filling vias.

Topics Covered:

• The differences between plugging and filling vias, and when to use each method.
• The common challenges faced during the reflow process, including the infamous "popcorn effect" caused by trapped flux.
• Practical advice on preventing manufacturing issues related to via plugging.
• Cost considerations between tenting, plugging, and filling vias.
• Insights into using various materials for via filling, including epoxy and solder.
• A fascinating case study on using solder to plug vias for gas sensors.
• The importance of thoughtful PCB design and silkscreen placement to avoid manufacturing headaches.

Key Takeaways:

• Plugging vias can prevent air and flux entrapment, but must be carefully specified in the design.
• There’s a delicate balance between cost and functionality when choosing how to handle vias.
• Thoughtful design and clear communication with manufacturers can lead to smoother production and better results.

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In this episode, Chris and Melissa we are focused on the topic of tenting vias. Joined by our favorite PCB guru, Dave Wilcox, we dive into the thrilling question: is it "via" or "v-eye-a"? We discuss the technical details behind different types of vias, tenting methods, and the potential manufacturing challenges that arise from improper designs such as why covering one side of a via might just lead to a tiny PCB firework show. Make sure to look out for part 2 of this episode where we continue on to learn about plugging and filling vias.

Reference Links

https://resources.altium.com/p/IPC-vias

https://www.wellpcb.com/blog/pcb-manufacturing/non-conductive/

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