Low Foot Print OPC UA Over TSN for Real-Time Communication - Melvin Francis has 8+ years of experience in the IT Industry in the Design and Development of Embedded firmware for Industrial automation systems. He is an Expert in Industrial Ethernet protocols like Profinet, EtherCAT, Ethernet/IP, openPOWERLINK, OPC UA, TSN, and DDS. Contributed to the development of IIoT and Industrie 4.0 projects. Building time-critical systems on various RTOS platforms like Embedded Linux, freeRtos, VX Woks, Micrium OS, and MQX is his expertise

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BE Services Website: https://be-services.com/

Project Link: www.etsn.io

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In order to meet the demand for a low-footprint SDK stack that can quickly and easily be used by machine builders, We collaborated with Offenburg University to start a research project funded by the Zentrales Innovations program Mittelstand (ZIM). The goal of the research project is to design an Software development kit that includes all the essential components necessary to run user applications over the OPC UA + TSN infrastructure. Fig shows the block diagram of the SDK highlighting the essential components. The main components of the SDK include the PTP stack, LLDP, RTOS, TCP/IP Stack, security module, OPC UA, and configuration module. SDK targets to be used on embedded devices with limited resources. So the optimization of the footprint of each component is an important aspect that should ensure that the application gets sufficient processing power and memory for the execution of the user logic. The SDK would also be designed to support multiple hardware and operating system on release.